Wafer HV

The FTI‑1000 is a purpose‑built ATE system designed for high‑coverage wafer‑level testing of power discrete devices, wide‑bandgap components, and gate‑driver‑integrated power ICs. Suitable for both engineering characterization and high‑volume wafer sort, the system integrates independent DC and AC test resources capable of measuring all key MOSFET parameters, including DC characteristics, ΔVsd, inductive switching (UIL/UIS/CIS), gate charge, and gate resistance. Its modular Tester‑per‑Channel Board architecture, built on a USB‑based framework, enables straightforward system expansion and configuration flexibility for both single‑site and multisite probe applications.
With flexible resource partitioning and plug‑in options such as high‑voltage extensions, high‑current pulse modules, digitizers, and LCR‑based Rg measurement, the FTI‑1000 adapts seamlessly to a wide range of wafer‑level test requirements while maintaining a compact footprint. The architecture integrates cleanly with automated wafer probers and probe‑card interfaces—without being tied to any specific mechanical platform—making it equally effective for early‑stage device characterisation, process development, and high‑volume wafer‑sort operations.
FTI Studio software supports efficient test program development with tools such as waveform capture, automated data‑sheet generation, schmoo plotting, and AEC‑Q001 Rev. C PAT analysis. This combination of modular hardware, comprehensive test capability, and intuitive software makes the FTI‑1000 an ideal wafer‑test solution where flexibility, scalability, and high performance are essential, particularly in automotive, industrial, and wide‑bandgap power device sectors.