Services
Complete Test Services for Semiconductors
The Services division provides a full range of test services, from wafer sort and final production testing to characterization, qualification, reliability testing, and advanced failure and technology analysis, as well as ASIC design and design-for-testability (DFT) support to optimize device performance, testability, and time-to-market.
From ASIC Design to the Market
The Cosmic Services division provides a comprehensive portfolio of test services, supporting customers throughout the entire device lifecycle. Cosmic Services offers everything from customized test solution development, ASIC design with design-for-testability (DFT) support, to wafer sort and final production testing. On top of this, the division specializes in characterization and qualification testing in addition to burn-in and reliability testing. Cosmic ensures high-quality standards and fast execution for device troubleshooting projects ensured by advanced failure & technology analysis capabilities which enable precise identification of device failures through sophisticated failure analysis techniques, thereby supporting continuous improvement and product optimization processes.
Why Cosmic Services
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FAQ
Semiconductor Test Services encompass the entire lifecycle of testing validation activities performed on an Integrated Circuit (IC) or Application Specific Integrated Circuit (ASIC). These services are critical because they ensure the device meets all electrical, functional, and reliability specifications before mass production and use in end applications (especially in safety-critical sectors like Automotive or Aerospace). They include everything from early Design for Testability (DFT) to final Production Test and Failure Analysis (Failure Analysis).
We become an all-in-one partner solution starting from the ASIC Design phase by applying Design for Testability (DFT) principles. This proactive involvement ensures that the circuit is inherently testable, which is vital for:
- Maximizing fault coverage (the percentage of possible defects that can be detected).
- Reducing the complexity and cost of the subsequent test program development.
- Optimizing the overall time to market.
- Characterization Test (on wafer and on packaged devices): This phase performs in-depth electrical functional measurements to determine if the device has been designed correctly and how its performance varies across different conditions (e.g., PVT – Process, Voltage, Temperature). It is diagnostic and essential for design validation.
- Production Test (Wafer Sort – WS / Final Test – FT): This is the high-volume, pass/fail screening performed to ensure every device delivered meets specifications. The focus here is on efficiency, Test Time Reduction, and maximizing Production Yield.
Yes. We specialize in the in-house development and manufacturing of complete custom test solutions, including the Test Program (Software) and the necessary hardware, such as Probe Cards and Load Boards (or socket boards). This tailored approach ensures maximum accuracy and efficiency for your specific device under test (DUT).